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HN1D01FU,LF(T - Toshiba

Description: Diode Switching 85V 0.1A 6-Pin US

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HN1D01FU,LF(T - Toshiba PCB footprint - Other - Other - SSOP6-P-0.65A (US6)_1
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HN1D01FU,LF(T - Toshiba  - 3D model - Other - SSOP6-P-0.65A (US6)_1
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HN1D01FU,LF(T Details

  • Manufacturer Part Number:

    HN1D01FU,LF(T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.1

  • Application:

    ULTRA FAST RECOVERY

  • Configuration:

    2 BANKS, COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-G6

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    0.2 W

  • Rep Pk Reverse Voltage-Max:

    85 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    80 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

HN1D01FU,LF(T Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • Implement a heat sink or thermal management system, and ensure the device is operated within the recommended temperature range (TJ = -40°C to 150°C).
  • The maximum allowed voltage for the input pins is 5.5V, exceeding which may cause damage to the device.
  • Yes, the HN1D01FU,LF(T is suitable for high-frequency switching applications up to 100 kHz, but ensure proper PCB layout and decoupling to minimize ringing and EMI.
  • Implement ESD protection measures such as TVS diodes, ESD filters, or ESD-resistant components to prevent damage from electrostatic discharge.

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