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HPL758040FR33MRD3P - TDK

Description: SMD / SMT Inductors (Coils), L=330nH, L x W x T : 7.5x8.0x4.0

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HPL758040FR33MRD3P - TDK PCB footprint - Other - Other - HPL758040FR33MRD3P-4
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HPL758040FR33MRD3P - TDK  - 3D model - Other - HPL758040FR33MRD3P-4
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HPL758040FR33MRD3P Details

  • Manufacturer Part Number:

    HPL758040FR33MRD3P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    3

  • Case/Size Code:

    3130

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.00061 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    4 mm

  • Package Length:

    8 mm

  • Package Style:

    SMT

  • Package Width:

    7.5 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    43 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL IN-LINE

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

HPL758040FR33MRD3P Frequently Asked Questions (FAQs)

  • The recommended land pattern for the HPL758040FR33MRD3P can be found in the TDK Corporation's application note or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To prevent damage, handle the HPL758040FR33MRD3P by the edges, avoid touching the pads or components, and use an anti-static wrist strap or mat. It is also recommended to follow the IPC-A-610 standard for handling and assembly of electronic components.
  • The thermal management strategy for the HPL758040FR33MRD3P involves providing a thermal path from the component to a heat sink or a metal core PCB. This can be achieved by applying a thermal interface material, such as thermal tape or thermal grease, between the component and the heat sink or metal core PCB.
  • The HPL758040FR33MRD3P is designed to withstand certain levels of vibration, but it is essential to evaluate the component's performance in the specific vibration environment. TDK Corporation provides vibration testing data, and it is recommended to consult with their application engineers for specific guidance.
  • To determine the reliability of the HPL758040FR33MRD3P, it is recommended to consult with TDK Corporation's application engineers and provide them with the specific application details, including the operating conditions, power cycling, and environmental factors. They can provide guidance on the component's reliability and suggest potential derating or modifications to ensure reliable operation.

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HPL758040FR33MRD3P Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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