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HRG3216P-2001-D-T1 - Susumu

Description: Thin Film Resistors - SMD 1.0W 2K ohm 0.5% 1206 25ppm

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HRG3216P-2001-D-T1 - Susumu - PCB symbol
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PCB Footprints
HRG3216P-2001-D-T1 - Susumu PCB footprint - Resistor Chip - Resistor Chip - 1206 (3216 Metric)_2026-2.2
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HRG3216P-2001-D-T1 - Susumu - 3D model - Resistor Chip - 1206 (3216 Metric)_2026-2.2
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HRG3216P-2001-D-T1 Details

  • Manufacturer Part Number:

    HRG3216P-2001-D-T1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Susumu Co Ltd

  • YTEOL:

    11

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    2000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Terminal Finish:

    MATTE TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    200 V

HRG3216P-2001-D-T1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the HRG3216P-2001-D-T1 can be found in the Susumu Co Ltd's application note or by contacting their technical support team. Generally, a land pattern with a 1:1 ratio of pad size to component size is recommended.
  • The HRG3216P-2001-D-T1 has a thermal resistance of 35°C/W. To handle thermal management, ensure good airflow, use a heat sink if necessary, and follow proper PCB design guidelines for thermal dissipation.
  • The maximum operating temperature range for the HRG3216P-2001-D-T1 is -40°C to 125°C. However, it's recommended to operate within the specified temperature range for optimal performance and reliability.
  • The HRG3216P-2001-D-T1 is designed to withstand moderate vibration. However, for high-vibration environments, it's recommended to consult with Susumu Co Ltd's technical support team for specific guidance on mounting and securing the component.
  • The recommended soldering profile for the HRG3216P-2001-D-T1 follows the standard reflow soldering profile, with a peak temperature of 260°C and a dwell time of 20-30 seconds. Consult the datasheet or Susumu Co Ltd's application note for more information.

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HRG3216P-2001-D-T1 Overview

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Part Image PHPA1206E2001DSBS Vishay Intertechnologies

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Part Image PHPA1206E2001DST3 Vishay Intertechnologies

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Part Image PHPA1206E2001DST5 Vishay Intertechnologies

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Part Image HRG3216P-2001-D-T5 Susumu Co Ltd

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