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HSA2-040SIA/A2S23 - Microchip

Description: 32 KB Flash 2048 RAM FS-USB 2.0 12-bit ADC

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HSA2-040SIA/A2S23 - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (SO)28-Lead(SOIC)-1
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HSA2-040SIA/A2S23 - Microchip  - 3D model - Small Outline Packages - (SO)28-Lead(SOIC)-1
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  • Datasheet
  • Stock & Prices $ Price & Stock for HSA2-040SIA/A2S23
  • Part Number HSA2-040SIA/A2S23
  • Manufacturer Microchip
  • Pin Count 28
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - (SO)28-Lead(SOIC)-1
  • Released Date Mar 9, 2022
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

HSA2-040SIA/A2S23 Details

  • Manufacturer Part Number:

    HSA2-040SIA/A2S23

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SOIC-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.87 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.64 mm

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.49 mm

  • uPs/uCs/Peripheral ICs Type:

    CAPACITIVE TOUCH SCREEN CONTROLLERS

HSA2-040SIA/A2S23 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow and avoid blocking airflow around the device. Consider using a thermal interface material to improve heat transfer.
  • Power up the device in the following sequence: VCC, VDD, and then VPP. Power down in the reverse sequence. Ensure a minimum of 100 ms delay between power-up and power-down sequences.
  • Use an ESD wrist strap or mat during handling and assembly. Ensure that the device is stored in an anti-static bag or container. Avoid touching the device pins or leads during handling.
  • Use a reflow soldering profile with a peak temperature of 240°C to 250°C, and a dwell time of 30 seconds to 60 seconds. Ensure that the device is properly aligned and secured during the soldering process.

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HSA2-040SIA/A2S23 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image HSA2-040SIA/A2S23TR Microchip Technology Inc

32 KB Flash, 2048 RAM, FS-USB 2.0, 12-bit ADC