HSMS-2800-TR1G footprint, schematic symbol and 3D model by Avago Technologies

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Part Number HSMS-2800-TR1G
Manufacturer Avago Technologies
Pin Count 3
Part Category Diode
Package Category SOT23 (3-Pin)
Footprint Name SOT23 (3-Pin) - Outline 23
Released Date Dec 9, 2017
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

HSMS-2800-TR1G Details

Manufacturer Part Number:
HSMS-2800-TR1G
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
R-PDSO-G3
Pin Count:
3
Reach Compliance Code:
Compliant
ECCN Code:
EAR99
HTS Code:
8541.10.00.60
Manufacturer:
Avago Technologies
YTEOL:
0
Configuration:
SINGLE
Diode Capacitance-Max:
2 pF
Diode Element Material:
SILICON
Diode Type:
MIXER DIODE
Forward Voltage-Max (VF):
0.41 V
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e4
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
70 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
NICKEL PALLADIUM GOLD
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
20

HSMS-2800-TR1G Frequently Asked Questions (FAQs)

A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize signal reflections. A 50-ohm microstrip transmission line should be used for the RF signal path.
The device requires a single 5V power supply. A 10uF capacitor should be placed between the VCC pin and ground to filter out noise. A 1kohm resistor should be used to bias the VCC pin to 5V.
The HSMS-2800-TR1G is designed to operate up to 2.5 GHz, but it can be used up to 3.5 GHz with some degradation in performance.
The device has a thermal pad on the bottom that should be connected to a thermal ground plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer. The device can operate up to 125°C junction temperature.
The device has internal ESD protection diodes that can withstand up to 2kV human body model (HBM) and 100V machine model (MM) ESD events.

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HSMS-2800-TR1G Overview

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HSMS-2800-TR1G - Avago Technologies