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HSMS-282P-TR1G - Avago Technologies

Description: MIXER DIODE, C BAND, SILICON Surface Mount RF Schottky Barrier Diodes

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PCB Footprints
HSMS-282P-TR1G - Avago Technologies PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-363
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3D Models
HSMS-282P-TR1G - Avago Technologies  - 3D model - SOT23 (6-Pin) - SOT-363
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HSMS-282P-TR1G Details

  • Manufacturer Part Number:

    HSMS-282P-TR1G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-70

  • Package Description:

    R-PDSO-G6

  • Pin Count:

    6

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    0

  • Configuration:

    2 BANKS, SERIES CONNECTED, CENTRE TAP, 2 ELEMENTS

  • Diode Capacitance-Max:

    0.2 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    0.34 V

  • Frequency Band:

    C BAND

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    15 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

HSMS-282P-TR1G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize signal reflections. A 50-ohm microstrip transmission line should be used to connect the device to the antenna.
  • The device requires a single 2.7V to 5.5V power supply. A 10uF capacitor should be connected between the VCC pin and ground to filter out noise. A 1kohm resistor should be connected between the EN pin and VCC to enable the device.
  • The device can handle up to 20dBm of input power. Exceeding this limit may cause damage to the device or affect its performance.
  • Use a spectrum analyzer to check the output frequency and power level. Verify that the device is properly biased and that the input signal is within the specified range. Check for any signs of overheating or physical damage to the device.
  • Yes, the device is compatible with lead-free soldering processes. However, the peak reflow temperature should not exceed 260°C to prevent damage to the device.

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HSMS-282P-TR1G Overview

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