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HSMW-C120 - Avago Technologies

Description: 3.6 V White LED 1606 SMD, Broadcom HSMW-C120

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HSMW-C120 - Avago Technologies PCB footprint - Other - Other - HSMW-C120-2
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HSMW-C120 Details

  • Manufacturer Part Number:

    HSMW-C120

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    1.60 X 0.60 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, SMT, 2 PIN

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8541.40.20.00

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    7

  • Additional Feature:

    SUPPORTS INFRARED

  • Color:

    WHITE

  • Color@Wavelength:

    White

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.02 A

  • Forward Voltage-Max:

    3.9 V

  • JESD-609 Code:

    e4

  • Lens Type:

    UNTINTED DIFFUSED

  • Luminous Intensity-Nom:

    160.0 mcd

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    SINGLE COLOR LED

  • Overall Height:

    1 mm

  • Packing Method:

    TR, 7 INCH

  • Reverse Voltage-Max:

    5 V

  • Shape:

    RECTANGULAR

  • Size:

    1.2 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Viewing Angle:

    155 deg

HSMW-C120 Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near the center of the board. Thermal management involves using a heat sink with a thermal interface material, and ensuring good airflow around the device.
  • To optimize power consumption, use the device's power-saving modes, such as the 'Low Power Mode' or 'Sleep Mode', and adjust the clock frequency and voltage supply accordingly. Additionally, consider using a power management IC to regulate power supply to the device.
  • To minimize EMI and RFI, use a metal shield around the device, and ensure that the PCB layout is designed to minimize radiation. Additionally, use EMI-absorbing materials and consider using a Faraday cage or shielded enclosure.
  • To ensure reliable data transmission and reception, use a robust transmission protocol, such as FEC (Forward Error Correction), and implement error detection and correction mechanisms. Additionally, consider using a redundant transmission mechanism, such as packet duplication.
  • The device has a maximum junction temperature of 125°C, and a maximum storage temperature of 150°C. Derating considerations include reducing the power supply voltage and clock frequency as the temperature increases, and ensuring good airflow around the device.

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HSMW-C120 Overview

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