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HSP45102SI-33Z - Renesas Electronics

Description: The Intersil HSP45102 is Numerically Controlled Oscillator (NCO12) with 32-bit frequency resolution and 12-bit output. With over 69dB of spurious free dynamic range and worst case frequency resolution of 0. 009Hz, the NCO12 provides significant accuracy for frequency synthesis solutions at a competitive price. The frequency to be generated is selected from two frequency control words. A single control pin selects which word is used to determine the output frequency. Switching from one frequency to another o

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HSP45102SI-33Z - Renesas Electronics - PCB symbol
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PCB Footprints
HSP45102SI-33Z - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M28.3
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HSP45102SI-33Z - Renesas Electronics - 3D model - Small Outline Packages - M28.3
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HSP45102SI-33Z Details

  • Manufacturer Part Number:

    HSP45102SI-33Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICW

  • Package Description:

    SOIC-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    M28.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    OFFSET BINARY OUTPUT

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    33 MHz

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Output Data Bus Width:

    12

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    99 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

  • uPs/uCs/Peripheral ICs Type:

    DSP PERIPHERAL, NUMERIC CONTROLLED OSCILLATOR

HSP45102SI-33Z Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the HSP45102SI-33Z involves keeping the input and output traces as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
  • The HSP45102SI-33Z has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane. Additionally, the device should be placed in a well-ventilated area to prevent overheating.
  • The recommended power-up sequence for the HSP45102SI-33Z is to apply the power supply voltage (VCC) before applying the input signals. The power supply voltage should be stable and within the recommended operating range before applying the input signals.
  • To troubleshoot issues with the HSP45102SI-33Z, start by verifying that the power supply voltage is within the recommended operating range and that the input signals are correct. Use an oscilloscope to check the output signals and verify that they are within the expected range. Check the PCB layout and ensure that it meets the recommended layout guidelines. If the issue persists, consult the datasheet and application notes for further guidance.
  • The HSP45102SI-33Z is a sensitive device and requires proper ESD protection during handling and assembly. It is recommended to use an ESD wrist strap or mat, and to handle the device by the package body only, avoiding contact with the pins. The device should also be stored in an ESD-protective package or bag when not in use.

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HSP45102SI-33Z Overview

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