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HV2601FG-G - Microchip

Description: Analog Switch ICs Lo-Charge 16-Channel High Voltage

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HV2601FG-G - Microchip - PCB symbol
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PCB Footprints
HV2601FG-G - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 48 Pin TQFP (FG)
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3D Models
HV2601FG-G - Microchip - 3D model - Quad Flat Packages - 48 Pin TQFP (FG)
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HV2601FG-G Details

  • Manufacturer Part Number:

    HV2601FG-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    48

  • Manufacturer Package Code:

    LQFP-48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    3 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    -30 V

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Normal Position:

    NO

  • Number of Channels:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Off-state Isolation-Nom:

    33 dB

  • On-state Resistance Match-Nom:

    1.9 Ω

  • On-state Resistance-Max (Ron):

    38 Ω

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max (Isup):

    4 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    5000 ns

  • Switch-on Time-Max:

    5000 ns

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

HV2601FG-G Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the HV2601FG-G involves keeping the high-voltage traces as short as possible, using a solid ground plane, and minimizing the loop area of the high-voltage traces to reduce electromagnetic interference (EMI).
  • To ensure reliable operation of the HV2601FG-G in high-temperature environments, it is recommended to follow proper thermal design guidelines, such as using a heat sink, ensuring good airflow, and derating the device's operating voltage and current according to the datasheet.
  • Key considerations for EMI and RFI mitigation when using the HV2601FG-G include using a shielded enclosure, keeping high-voltage traces away from sensitive analog circuits, and using EMI filters or ferrite beads on the input and output lines.
  • To troubleshoot issues with the HV2601FG-G, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly soldered and that there are no signs of physical damage. Use an oscilloscope to check for voltage ripple or oscillations, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • When using the HV2601FG-G in a high-reliability or safety-critical application, it is essential to follow strict design and testing guidelines, such as those outlined in IEC 61508 or DO-254. This includes performing thorough risk assessments, implementing redundant systems, and conducting extensive testing and validation.

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HV2601FG-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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