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HV2803/AHA - Microchip

Description: ±4.5V ~ 6.3V, 0°C ~ 70°C, 15Ohm, Ultrasound Switch IC 32 Channel 132-TFBGA (12x12)

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Symbol
HV2803/AHA - Microchip - PCB symbol
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PCB Footprints
HV2803/AHA - Microchip PCB footprint - BGA - BGA - 132-Ball Thin Fine Pitch Ball Grid Array (AHA)-12x12x1.2mm
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3D Models
HV2803/AHA - Microchip - 3D model - BGA - 132-Ball Thin Fine Pitch Ball Grid Array (AHA)-12x12x1.2mm
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HV2803/AHA Details

  • Manufacturer Part Number:

    HV2803/AHA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-132

  • Pin Count:

    132

  • Manufacturer Package Code:

    TFBGA-132

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-12-14

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Analog IC - Other Type:

    SPST

  • Input Voltage-Max:

    100 V

  • Input Voltage-Min:

    -100 V

  • JESD-30 Code:

    S-PBGA-B132

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Neg Supply Voltage-Max (Vsup):

    -4.5 V

  • Neg Supply Voltage-Min (Vsup):

    -6.3 V

  • Neg Supply Voltage-Nom (Vsup):

    -6 V

  • Normal Position:

    NO

  • Number of Channels:

    32

  • Number of Functions:

    16

  • Number of Terminals:

    132

  • Off-state Isolation-Nom:

    70 dB

  • On-state Resistance Match-Nom:

    3 Ω

  • On-state Resistance-Max (Ron):

    15 Ω

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA132,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    3 A

  • Supply Current-Max (Isup):

    6 mA

  • Supply Voltage-Max (Vsup):

    6.3 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    6 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    5000 ns

  • Switch-on Time-Max:

    5000 ns

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    12 mm

HV2803/AHA Frequently Asked Questions (FAQs)

  • Microchip provides a recommended layout and routing guide in the HV2803/AHA evaluation board user's guide, which includes guidelines for PCB layout, component placement, and routing to minimize noise and ensure optimal performance.
  • Microchip provides a troubleshooting guide in the HV2803/AHA datasheet, which includes steps to identify and resolve common issues, such as checking the input voltage, output voltage, and current sense resistors, as well as verifying the configuration and programming of the device.
  • Yes, the HV2803/AHA is designed to meet the requirements of high-reliability and high-temperature applications, with a specified operating temperature range of -40°C to +125°C and a high-reliability qualification according to AEC-Q100 Grade 1.
  • The HV2803/AHA can be programmed and configured using the SPI or I2C interface, and Microchip provides a software development kit (SDK) and programming tools, such as the MPLAB X IDE and the HV2803/AHA configuration tool, to simplify the programming and configuration process.
  • The HV2803/AHA has a thermal pad on the bottom of the package, and Microchip recommends using a thermal interface material (TIM) and a heat sink to ensure proper heat dissipation, as well as following the thermal management guidelines in the datasheet and application notes.

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HV2803/AHA Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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