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HV2901K6-G - Microchip

Description: Analog Switch ICs 32CH HV 200V ANALOG SWITCH

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PCB Footprints
HV2901K6-G - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN 64-
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3D Models
HV2901K6-G - Microchip  - 3D model - Quad Flat No-Lead - QFN 64-
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HV2901K6-G Details

  • Manufacturer Part Number:

    HV2901K6-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    QFN-64

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Analog IC - Other Type:

    SPDT

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    -30 V

  • JESD-30 Code:

    S-XQCC-N64

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    32

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Off-state Isolation-Nom:

    33 dB

  • On-state Resistance Match-Nom:

    1.9 Ω

  • On-state Resistance-Max (Ron):

    38 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.32SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    3 A

  • Supply Current-Max (Isup):

    3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    5000 ns

  • Switch-on Time-Max:

    5000 ns

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

HV2901K6-G Frequently Asked Questions (FAQs)

  • A good PCB layout for the HV2901K6-G involves keeping the high-voltage traces short and away from low-voltage traces, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure good thermal management by providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources. Also, follow the recommended operating temperature range and derate the device's performance accordingly.
  • The HV2901K6-G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, grounding straps, and follow proper handling techniques to prevent damage to the device.
  • The HV2901K6-G is a high-reliability device, but it's essential to follow Microchip's guidelines for high-reliability applications. Ensure you meet the required specifications, follow proper design and testing procedures, and obtain any necessary certifications or compliance marks.
  • To troubleshoot issues with the HV2901K6-G, start by reviewing the device's datasheet and application notes. Check the power supply, input voltage, and output voltage for any anomalies. Use oscilloscopes or logic analyzers to monitor the device's signals and identify potential issues. Consult Microchip's technical support or application notes for guidance.

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HV2901K6-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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