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HV509K6-G - Microchip

Description: Serial to Parallel Logic Converters 16-Ch Ser/Parallel Converter

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PCB Footprints
HV509K6-G - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-Lead QFN-ren2
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3D Models
HV509K6-G - Microchip  - 3D model - Quad Flat No-Lead - 32-Lead QFN-ren2
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HV509K6-G Details

  • Manufacturer Part Number:

    HV509K6-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    16

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    SIPO BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    70 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.20SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    3 V

  • Supply Voltage1-Max:

    200 V

  • Supply Voltage1-Min:

    50 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Turn-off Time:

    300.5 µs

  • Turn-on Time:

    300.5 µs

  • Width:

    5 mm

HV509K6-G Frequently Asked Questions (FAQs)

  • A good PCB layout for the HV509K6-G involves keeping the high-voltage traces short and away from sensitive analog signals. Use a solid ground plane and decouple the power supplies with capacitors. Microchip provides a reference design and layout guidelines in their application notes.
  • To ensure reliable operation in high-temperature environments, follow the recommended thermal management guidelines in the datasheet. Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, consider derating the output current and voltage according to the temperature derating curves in the datasheet.
  • To ensure EMI and EMC compliance, use a shielded enclosure, keep the high-voltage traces short, and use a common-mode choke or ferrite bead to filter the output. Also, follow the recommended layout guidelines and use a low-pass filter on the output to reduce electromagnetic emissions.
  • To troubleshoot issues with the HV509K6-G, start by checking the input power supply, output voltage, and current. Verify that the device is properly soldered and that the PCB layout follows the recommended guidelines. Use an oscilloscope to check for voltage ripple or oscillations, and a thermal camera to identify hotspots. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • When using the HV509K6-G in a high-reliability or safety-critical application, consider the device's failure modes, fault tolerance, and redundancy. Implement redundant power supplies, overvoltage protection, and overcurrent protection. Follow the recommended design guidelines and consult with a qualified engineer or safety expert to ensure compliance with relevant safety standards.

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HV509K6-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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