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HV5122PG-G - Microchip

Description: Serial to Parallel Logic Converters 220V 32Ch Open D Out

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HV5122PG-G - Microchip - PCB symbol
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PCB Footprints
HV5122PG-G - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 44-Lead PQFP
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HV5122PG-G - Microchip - 3D model - Quad Flat Packages - 44-Lead PQFP
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HV5122PG-G Details

  • Manufacturer Part Number:

    HV5122PG-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    10.00 X 10.00 MM, 2.45 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, MS-112AA, QFP-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    PQFP-44

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    EL DISPLAY DRIVER

  • JESD-30 Code:

    S-PQFP-G44

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    32

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP44,.52SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.35 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    10.8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • fmax-Min:

    8 MHz

HV5122PG-G Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding topology, keeping analog and digital grounds separate, and using a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • Follow the recommended power-up sequence: VDD, VCC, and then VIN. For power-down, reverse the sequence. Ensure that the voltage supplies are stable and within the recommended range before applying them to the device.
  • The maximum allowable voltage on the output pins is VCC + 0.3V. To protect against overvoltage, use a voltage clamp or a zener diode to limit the voltage to within the recommended range.
  • Optimize the output voltage and current to the minimum required for the application. Use a low-dropout regulator (LDO) for the VCC supply, and consider using a switching regulator for the VIN supply. Ensure good thermal design and heat sinking to minimize heat generation.
  • Follow standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation. Ensure that the device is stored in an ESD-protective package, and handle the device by the body or pins, rather than the leads.

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HV5122PG-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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