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HV56264T-E/QEX-VAO - Microchip

Description: 4-CH HV AMP 250V TSSOP

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HV56264T-E/QEX-VAO - Microchip - PCB symbol
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HV56264T-E/QEX-VAO - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - HV56264T-E/QEX-VAO
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HV56264T-E/QEX-VAO Details

  • Manufacturer Part Number:

    HV56264T-E/QEX-VAO

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    TSSOP-24

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Frequency Compensation:

    YES

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Micropower:

    NO

  • Number of Functions:

    4

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    4 V/us

  • Slew Rate-Nom:

    11 V/us

  • Supply Current-Max:

    8.3 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Voltage Gain-Min:

    50

  • Wideband:

    NO

  • Width:

    4.4 mm

HV56264T-E/QEX-VAO Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the HV56264T-E/QEX-VAO evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The HV56264T-E/QEX-VAO has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A heat sink or thermal interface material can be used to improve thermal conductivity. Additionally, ensure good airflow around the device and avoid blocking the thermal pad with components or soldermask.
  • The HV56264T-E/QEX-VAO has an operating temperature range of -40°C to +125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure that the device is operated within the recommended temperature range to prevent damage or malfunction.
  • The HV56264T-E/QEX-VAO can be programmed using the SPI interface. Microchip provides a software development kit (SDK) and example code to help users program the device's internal registers and configure its operation.
  • The recommended power-up sequence for the HV56264T-E/QEX-VAO is to apply the VDD supply voltage first, followed by the VPP supply voltage. Ensure that the VDD voltage is stable before applying the VPP voltage to prevent damage or malfunction.

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HV56264T-E/QEX-VAO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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