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HV5812P-G - Microchip

Description: 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid

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HV5812P-G - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 28-Lead PDIP (.600in Row Spacing) Package Outline (P)
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HV5812P-G - Microchip  - 3D model - Dual-In-Line Packages - 28-Lead PDIP (.600in Row Spacing) Package Outline (P)
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HV5812P-G Details

  • Manufacturer Part Number:

    HV5812P-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    1.565 X 0.580 INCH, 0.250 INCH HEIGHT, 0.100 INCH PITCH, GREEN, PLASTIC, MS-011AB, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    PDIP-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    VACUUM FLUORESCENT DISPLAY DRIVER

  • JESD-30 Code:

    R-PDIP-T28

  • JESD-609 Code:

    e3

  • Length:

    37.4 mm

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    20

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    6.35 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    80 V

  • Supply Voltage1-Min:

    20 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

HV5812P-G Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the HV5812P-G evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the HV5812P-G has a built-in thermal shutdown feature that can be used to prevent damage from overheating.
  • When selecting external components for the HV5812P-G, key considerations include the voltage rating, current handling, and power dissipation of the components. It is also essential to ensure that the components are compatible with the HV5812P-G's operating frequency and can handle the high-voltage switching transients. Microchip provides guidance on component selection in the HV5812P-G datasheet and application notes.
  • To troubleshoot common issues with the HV5812P-G, it is essential to follow a systematic approach, including checking the power supply, output voltage, and current, as well as verifying the correctness of the PCB layout and component selection. Microchip provides troubleshooting guidelines and application notes that can help identify and resolve common issues.
  • When working with the HV5812P-G, it is essential to take safety precautions to avoid electrical shock, injury, or damage to the device. This includes using proper safety equipment, such as safety glasses and insulated tools, and ensuring that the device is properly connected and configured to prevent accidental high-voltage discharge.

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HV5812P-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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