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HV7350K6-G - Microchip

Description: RF Front End 8-Ch Hi-Speed Ultra- Sound RTZ Pulser

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PCB Footprints
HV7350K6-G - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 56-Lead QFN
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3D Models
HV7350K6-G - Microchip  - 3D model - Quad Flat No-Lead - 56-Lead QFN
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HV7350K6-G Details

  • Manufacturer Part Number:

    HV7350K6-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    VQFN-56

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e4

  • Length:

    8 mm

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.3SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.2 V

  • Supply Voltage-Min (Vsup):

    2.97 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    HVCMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

HV7350K6-G Frequently Asked Questions (FAQs)

  • A good PCB layout for the HV7350K6-G involves keeping the high-voltage traces short and away from sensitive analog signals, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable startup and shutdown, make sure to follow the recommended power-up and power-down sequences outlined in the datasheet. Also, ensure that the input voltage rises and falls monotonically, and that the device is not subjected to voltage spikes or dips during startup and shutdown.
  • The HV7350K6-G has a maximum junction temperature of 150°C. To ensure proper heat dissipation, use a heat sink with a thermal resistance of less than 10°C/W, and ensure good airflow around the device. Also, avoid blocking the airflow around the device and ensure that the PCB is designed to dissipate heat efficiently.
  • To troubleshoot issues with the HV7350K6-G, start by checking the input voltage and current, and ensuring that the device is properly configured. Use an oscilloscope to monitor the output voltage and current, and check for any signs of oscillation or instability. Also, check the thermal performance of the device and ensure that it is properly heat-sinked.
  • Yes, the HV7350K6-G is designed to meet the requirements of high-reliability and safety-critical applications. However, it is essential to follow the recommended design and layout guidelines, and to perform thorough testing and validation to ensure that the device meets the required safety and reliability standards.

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HV7350K6-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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ULTRASOUND RTZ PULSER