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HV9910BNG-G - Microchip

Description: LED Driver, Uni. High Brightness, SOIC N Microchip HV9910BNG-G LED Driver IC, 8 → 450 V dc 16-Pin SOIC

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HV9910BNG-G - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin SOIC (Narrow) (NG)
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HV9910BNG-G - Microchip  - 3D model - Small Outline Packages - 16-Pin SOIC (Narrow) (NG)
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HV9910BNG-G Details

  • Manufacturer Part Number:

    HV9910BNG-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOIC-16

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    450 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.9 mm

HV9910BNG-G Frequently Asked Questions (FAQs)

  • A good PCB layout for the HV9910BNG-G involves keeping the high-voltage traces short and away from sensitive analog signals, using a solid ground plane, and placing the input and output capacitors close to the IC. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 5V supply, and the EN pin to a logic-level signal (e.g., 3.3V or 5V) to enable the device. The VREF pin should be connected to a stable 2.5V reference voltage. Additionally, ensure that the input and output capacitors are properly sized and placed close to the IC.
  • The maximum allowable voltage on the HV pin is 700V. To protect the device from overvoltage, use a voltage limiter or a zener diode in series with a current-limiting resistor to prevent voltage spikes from exceeding the maximum rating. Additionally, ensure that the input and output capacitors are rated for the maximum voltage.
  • To troubleshoot issues with the HV9910BNG-G, start by verifying the PCB layout and ensuring that the input and output capacitors are properly sized and placed. Check the voltage on the HV pin and ensure it is within the recommended range. Use an oscilloscope to check for oscillations or instability, and verify that the EN pin is properly biased. If issues persist, consult the datasheet and application notes for further guidance.
  • The HV9910BNG-G is rated for operation up to 125°C. To ensure reliable operation in high-temperature environments, ensure good thermal conduction between the IC and the PCB, and consider using a heat sink or thermal interface material. Additionally, follow proper PCB design and layout guidelines to minimize thermal resistance.

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HV9910BNG-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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