Description:Available with wire bondable terminations
• Utilizes fine film resistor deposition technology
• Superior pulse handling capabilities
• Low TCR to 25 ppm/ºC
• Low VCR to 1 ppm/volt
• Very low noise
• Ultra-high stability
• Higher (up to 1TΩ) or lower resistance values may be available (contact Stackpole)
• RoHS compliant, REACH compliant, and halogen free
The recommended land pattern for HVCB0603FDD500M is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
Yes, HVCB0603FDD500M is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency (SRF). However, it's essential to consider the component's parasitic inductance and capacitance when designing the circuit.
HVCB0603FDD500M is rated for operation up to 150°C, making it suitable for high-temperature environments. However, the component's capacitance and ESR may vary with temperature, so it's essential to consider these changes when designing the circuit.
Yes, HVCB0603FDD500M is compatible with lead-free soldering processes, including RoHS and WEEE compliant processes. The component's terminations are made of a lead-free material that meets the requirements of these regulations.
HVCB0603FDD500M should be stored in a dry, cool place, away from direct sunlight and moisture. The component should be handled with care to avoid mechanical stress, and it's recommended to use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
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HVCB0603FDD500M Overview
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