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HVCB0805GDC200M - Stackpole Electronics, Inc.

Description: RES, HV, 0805, 200 Mohm, 2%, 50 ppm, 0.2W

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HVCB0805GDC200M - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
HVCB0805GDC200M - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - HVC0805
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HVCB0805GDC200M - Stackpole Electronics, Inc. - 3D model - Resistor Chip - HVC0805
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HVCB0805GDC200M Details

  • Manufacturer Part Number:

    HVCB0805GDC200M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.64 mm

  • Package Length:

    2.01 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.27 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.2 W

  • Rated Temperature:

    70 °C

  • Resistance:

    200000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    2%

  • Working Voltage:

    600 V

HVCB0805GDC200M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the HVCB0805GDC200M is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle the high voltage rating of the HVCB0805GDC200M, ensure that the PCB design includes adequate creepage and clearance distances between the component and other conductive elements, and consider using a high-voltage PCB material.
  • The HVCB0805GDC200M is rated for operation up to 150°C, but derating may be necessary for high-temperature applications. Consult the datasheet and manufacturer's recommendations for specific guidance.
  • To ensure reliability, follow proper PCB design and assembly guidelines, including using a robust soldering process, avoiding excessive thermal stress, and implementing adequate ESD protection.
  • The HVCB0805GDC200M is designed for high-voltage applications, but its high-frequency performance may be limited. Consult the datasheet and manufacturer's recommendations for specific guidance on high-frequency usage.

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HVCB0805GDC200M Overview

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HVCB0805GDC200M Alternates

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Part Image HVCB0805GTC200M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 2e+08ohm, 600V, 2% +/-Tol, 50ppm/Cel, Surface Mount, 0805
Part Image HVCG0805GDC200M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 2e+08ohm, 600V, 2% +/-Tol, 50ppm/Cel, Surface Mount, 0805
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Part Image HVCZ0805GKC200M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 2e+08ohm, 600V, 2% +/-Tol, 50ppm/Cel, Surface Mount, 0805
Part Image HVCZ0805GDC200M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 2e+08ohm, 600V, 2% +/-Tol, 50ppm/Cel, Surface Mount, 0805
For a full list of alternate parts for HVCB0805GDC200M, check out Findchips.com