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HVCB2010FKC100M - Stackpole Electronics, Inc.

Description: RES, HV, 2010, 100 Mohm, 1%, 50 ppm, 1W

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HVCB2010FKC100M - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - HVC2010
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HVCB2010FKC100M - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - HVC2010
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HVCB2010FKC100M Details

  • Manufacturer Part Number:

    HVCB2010FKC100M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    11

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.76 mm

  • Package Length:

    5.08 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.54 mm

  • Packing Method:

    TR, PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    100000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    2000 V

HVCB2010FKC100M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the HVCB2010FKC100M can be found in the SEI Stackpole Electronics Inc. application note or by contacting their technical support team.
  • The HVCB2010FKC100M has a thermal resistance of 35°C/W. To handle thermal management, ensure good airflow, use a heat sink if necessary, and follow proper PCB design guidelines for thermal dissipation.
  • The maximum operating temperature range for the HVCB2010FKC100M is -40°C to 150°C, as specified in the datasheet.
  • The HVCB2010FKC100M is designed to withstand vibrations up to 10G, but it's recommended to consult with SEI Stackpole Electronics Inc. for specific vibration requirements and to ensure the component meets the application's needs.
  • The recommended soldering profile for the HVCB2010FKC100M is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.

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HVCB2010FKC100M Overview

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Part Image HVCS2010FTC100M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 1W, 100000000ohm, 2000V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2010

Part Image HVCG2010FTC100M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 1W, 100000000ohm, 2000V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2010

Part Image HVCZ2010FKC100M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 1W, 100000000ohm, 2000V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2010

Part Image HVCZ2010FTC100M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 1W, 100000000ohm, 2000V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2010

For a full list of alternate parts for HVCB2010FKC100M, check out Findchips.com