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HVCB2512FDD200M - Stackpole Electronics, Inc.

Description: Available with wire bondable terminations Utilizes fine film resistor deposition technology Superior pulse handling capabilities Low TCR to 25 ppm/ºC VCR as low as 1 ppm/volt Very low noise Ultra-high stability

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PCB Footprints
HVCB2512FDD200M - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - HVC2512
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HVCB2512FDD200M - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - HVC2512
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HVCB2512FDD200M Details

  • Manufacturer Part Number:

    HVCB2512FDD200M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    10

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.76 mm

  • Package Length:

    6.35 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.18 mm

  • Packing Method:

    TR, PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    2 W

  • Rated Temperature:

    70 °C

  • Resistance:

    200000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    3000 V

HVCB2512FDD200M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the HVCB2512FDD200M is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • The HVCB2512FDD200M has a thermal resistance of 35°C/W. To handle thermal management, ensure good airflow around the component, use a heat sink if necessary, and avoid overheating the component.
  • The maximum operating temperature range for the HVCB2512FDD200M is -40°C to 150°C.
  • Yes, the HVCB2512FDD200M is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and ensure proper mounting and soldering.
  • To ensure reliability in a humid environment, ensure the component is stored in a dry environment, use a conformal coating, and follow the manufacturer's guidelines for humidity testing.

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HVCB2512FDD200M Overview

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Part Image HVCG2512FDD200M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 2W, 2e+08ohm, 3000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512

Part Image HVCS2512FKD200M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 2W, 2e+08ohm, 3000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512

Part Image HVCS2512FTD200M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 2W, 2e+08ohm, 3000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512

Part Image HVCG2512FKD200M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 2W, 2e+08ohm, 3000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512

Part Image HVCS2512FDD200M SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 2W, 2e+08ohm, 3000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512

For a full list of alternate parts for HVCB2512FDD200M, check out Findchips.com