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HVCB2512FDD30M0 - Stackpole Electronics, Inc.

Description: RES, HV, 2512, 30 Mohm, 1%, 100 ppm, 2W

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PCB Footprints
HVCB2512FDD30M0 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - 2512
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3D Models
HVCB2512FDD30M0 - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - 2512
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HVCB2512FDD30M0 Details

  • Manufacturer Part Number:

    HVCB2512FDD30M0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    10

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.76 mm

  • Package Length:

    6.35 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.18 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    2 W

  • Rated Temperature:

    70 °C

  • Resistance:

    30000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    3000 V

HVCB2512FDD30M0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the HVCB2512FDD30M0 can be found in the Stackpole Electronics Inc. application note AN-120, which provides guidelines for PCB layout and land pattern design.
  • When handling the HVCB2512FDD30M0, it is essential to follow proper ESD precautions and use a wrist strap or mat to prevent damage from electrostatic discharge. Additionally, ensure that the assembly and testing equipment are rated for high voltage to prevent damage to the component or the equipment.
  • The derating curve for the HVCB2512FDD30M0 can be obtained by contacting Stackpole Electronics Inc. directly or through their authorized distributors. They can provide the necessary information on how to derate the component's performance at high temperatures.
  • While the HVCB2512FDD30M0 is designed for high-voltage applications, its high-frequency performance may not be optimal. It is recommended to consult with Stackpole Electronics Inc. or their authorized distributors to determine the component's suitability for high-frequency applications and to obtain guidance on potential modifications or alternative components.
  • The HVCB2512FDD30M0 should be stored in a dry, cool place, away from direct sunlight and moisture. It is recommended to store the components in their original packaging or in a similar ESD-protective package to prevent damage. Handling should be done with clean, dry gloves or with a vacuum pickup tool to prevent contamination and damage.

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HVCB2512FDD30M0 Overview

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Part Image HVCB2512FTD30M0 SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 2W, 3e+07ohm, 3000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512

Part Image HVCB2512FHD30M0 SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 2W, 30000000ohm, 3000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP