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IA0509S - XP POWER

Description: XP Power IA 1W Isolated DC-DC Converter Through Hole, Vin 4.5 → 5.5 V dc, Vout ±9V dc, I/O isolation 1kV dc

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PCB Footprints
IA0509S - XP POWER PCB footprint - Other - Other - IA0509S-4
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3D Models
IA0509S - XP POWER  - 3D model - Other - IA0509S-4
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IA0509S Details

  • Manufacturer Part Number:

    IA0509S

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SIP-5

  • ECCN Code:

    EAR99

  • Manufacturer:

    XP Power

  • YTEOL:

    6

  • Additional Feature:

    LG-MAX; WD-MAX

  • Analog IC - Other Type:

    DC-DC UNREGULATED POWER SUPPLY MODULE

  • Approvals:

    CAN, CE, CSA, UL

  • Efficiency (Main Output):

    78%

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-XSMA-T5

  • Length:

    19.3 mm

  • Line Regulation-Max:

    1.2%

  • Load Regulation-Max:

    10%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.055 A

  • Output Voltage-Max:

    9.27 V

  • Output Voltage-Min:

    8.73 V

  • Output Voltage-Nom:

    9 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Ripple Voltage (Main Out):

    0.0265125 Vrms

  • Seated Height-Max:

    10.16 mm

  • Surface Mount:

    NO

  • Switching Frequency-Max:

    80 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    1 W

  • Trim/Adjustable Output:

    NO

  • Width:

    6.09 mm

IA0509S Frequently Asked Questions (FAQs)

  • XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
  • Yes, the IA0509S is designed to withstand high-vibration environments. However, it's essential to ensure that the module is properly secured to the PCB and that the PCB is rigid enough to prevent flexing or resonance that could affect the module's performance.
  • The maximum capacitance on the output of the IA0509S is 2200uF. Exceeding this value may affect the module's stability and performance.
  • Yes, you can parallel multiple IA0509S modules to increase the output power. However, it's crucial to ensure that the modules are identical and that the output voltages are matched to within 1% to prevent uneven current sharing.
  • XP Power recommends using a fuse with a rating of 5A or less to protect the module from input overcurrent conditions.

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IA0509S Overview

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