IBM25PPC750FL-GR0123T - IBM

IBM25PPC750FL-GR0123T Details

• Manufacturer Part Number:

  IBM25PPC750FL-GR0123T

• Pbfree Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  21 X 21 MM, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-292

• Pin Count:

  292

• ECCN Code:

  3A991.a.2

• HTS Code:

  8542.31.00.25

• Manufacturer:

  IBM

• YTEOL:

  0

• Address Bus Width:

  32

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  200 MHz

• External Data Bus Width:

  64

• Format:

  FLOATING POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-CBGA-B292

• JESD-609 Code:

  e1

• Length:

  21 mm

• Low Power Mode:

  YES

• Number of Terminals:

  292

• Package Body Material:

  CERAMIC, METAL-SEALED COFIRED

• Package Code:

  BGA

• Package Equivalence Code:

  BGA292,20X20,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.828 mm

• Speed:

  600 MHz

• Supply Voltage-Max:

  1.5 V

• Supply Voltage-Min:

  1.4 V

• Supply Voltage-Nom:

  1.45 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  21 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC