4 X 4 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-16
Manufacturer:
iC-Haus
Body Breadth:
4 mm
Body Height:
0.9 mm
Body Length or Diameter:
4 mm
Mounting Feature:
SURFACE MOUNT
Number of Terminals:
16
Operating Current-Max:
20 mA
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Output Type:
VOLTAGE OUTPUT
Package Shape/Style:
SQUARE
Sensors/Transducers Type:
MAGNETIC FIELD SENSOR,HALL EFFECT
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
3 V
Surface Mount:
YES
Termination Type:
SOLDER
IC-MA3QFN16-4X4 Frequently Asked Questions (FAQs)
The datasheet provides a recommended PCB layout for thermal performance, but it's essential to also consider the application's specific requirements. A good rule of thumb is to use a solid ground plane, minimize thermal vias, and ensure good airflow around the device.
The IC-MA3QFN16-4X4 requires a specific power sequencing order to prevent damage. Ensure that the VCC supply is powered up before the VDD supply, and that both supplies are powered down in the reverse order. A power sequencing circuit or a dedicated power management IC can help with this.
While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to consider the application's specific requirements and potential thermal gradients. In general, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal loop areas, and using shielding or filtering components as needed. Additionally, consider the device's radiation patterns and take measures to minimize electromagnetic interference (EMI).
The IC-MA3QFN16-4X4 is a QFN package, which requires specific soldering and rework conditions to prevent damage. Follow the recommended soldering profile, and use a rework station with a QFN-specific nozzle to prevent overheating or damaging the device.
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IC-MA3QFN16-4X4 Overview
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