IC-MDTSSOP20 footprint, schematic symbol and 3D model by ic-haus

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IC-MDTSSOP20 Details

The recommended PCB footprint for IC-MDTSSOP20 is a standard SOT23-6 footprint with a 1.5mm x 2.5mm body size and 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask layout.
The IC-MDTSSOP20 has a thermal pad on the bottom side, which should be connected to a thermal via or a copper plane on the PCB to dissipate heat. A thermal interface material (TIM) can also be used to improve heat transfer.
The IC-MDTSSOP20 is rated for operation from -40°C to +125°C, but the maximum junction temperature (Tj) should not exceed 150°C. The device should be derated for operation above 85°C.
The IC-MDTSSOP20 is a programmable device that requires a programming adapter and software from iC-Haus. The programming interface is typically a serial interface such as I2C or SPI.
The typical power consumption of IC-MDTSSOP20 depends on the specific configuration and operating mode. However, the datasheet specifies a typical supply current of 10mA to 50mA, depending on the output frequency and voltage.

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