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ICE3AR0680JZ - Infineon

Description: Infineon ICE3AR0680JZ AC/DC Driver, SMPS Current Mode 113 kHz, 7-Pin DIP

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PCB Footprints
ICE3AR0680JZ - Infineon PCB footprint - Other - Other - ICE3AR0680JZ-1
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3D Models
ICE3AR0680JZ - Infineon  - 3D model - Other - ICE3AR0680JZ-1
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ICE3AR0680JZ Details

  • Manufacturer Part Number:

    ICE3AR0680JZ

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DIP

  • Package Description:

    GREEN, PLASTIC, DIP-7

  • Pin Count:

    7

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    11.2 V

  • Input Voltage-Nom:

    17 V

  • JESD-30 Code:

    R-PDIP-T7

  • JESD-609 Code:

    e3

  • Length:

    9.385 mm

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP7/8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.8 mm

  • Surface Mount:

    NO

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    113 kHz

  • Technology:

    BICMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

ICE3AR0680JZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • A low-ESR ceramic capacitor (e.g., X7R or X5R) with a value of 4.7 μF to 10 μF is recommended for input decoupling. The capacitor should be placed close to the device's input pins.
  • Use a TVS diode or a zener diode for overvoltage protection. For overcurrent protection, use a fuse or a current-sensing resistor with a shutdown circuit. Also, ensure that the device is operated within its recommended operating conditions.
  • Keep the switching nodes (e.g., LX and VIN) as short and wide as possible. Use a solid ground plane and avoid routing signals under the device. Keep the layout symmetrical and balanced to minimize electromagnetic interference (EMI).

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ICE3AR0680JZ Overview

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