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ICE3B1565J - Infineon

Description: AC/DC Converters Off-Line SMPS Currnt Mode CTRLR 650V

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PCB Footprints
ICE3B1565J - Infineon PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PG-DIP-8
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ICE3B1565J - Infineon  - 3D model - Dual-In-Line Packages - PG-DIP-8
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ICE3B1565J Details

  • Manufacturer Part Number:

    ICE3B1565J

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    ROHS COMPLIANT, PLASTIC, DIP-8-6

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    26 V

  • Input Voltage-Min:

    10.3 V

  • Input Voltage-Nom:

    18 V

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.52 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    130 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.37 mm

  • Surface Mount:

    NO

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    76 kHz

  • Technology:

    BICMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.62 mm

ICE3B1565J Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (Tj) and adjust the design accordingly.
  • Monitor the output voltage, current, and temperature. Implement overvoltage protection (OVP), undervoltage protection (UVP), and overcurrent protection (OCP) to prevent damage and ensure reliable operation.
  • Use a shielded enclosure, keep the layout compact, and minimize loop areas. Use a common-mode choke and a Y-capacitor to reduce EMI. Follow the recommended layout guidelines and use a 4-layer PCB with a solid ground plane.
  • Use low-ESR capacitors with a high ripple current rating. For the input capacitor, a 10uF to 22uF ceramic or film capacitor is recommended. For the output capacitor, a 10uF to 47uF ceramic or electrolytic capacitor is recommended.

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ICE3B1565J Overview

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