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ICE3BR0680JZ - Infineon

Description: AC/DC Converters Off-Line SMPS Curr Cntlr w/integrt 800V

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PCB Footprints
ICE3BR0680JZ - Infineon PCB footprint - Other - Other - PG-DIP-7_2023
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3D Models
ICE3BR0680JZ - Infineon  - 3D model - Other - PG-DIP-7_2023
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ICE3BR0680JZ Details

  • Manufacturer Part Number:

    ICE3BR0680JZ

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DIP

  • Package Description:

    GREEN, PLASTIC, DIP-7

  • Pin Count:

    7

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    11.2 V

  • Input Voltage-Nom:

    17 V

  • JESD-30 Code:

    R-PDIP-T7

  • Length:

    9.385 mm

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    130 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP7/8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.8 mm

  • Surface Mount:

    NO

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    73.4 kHz

  • Technology:

    BICMOS

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

ICE3BR0680JZ Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 5 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and consider using a heat sink with a thermal resistance of less than 10 K/W.
  • A ceramic capacitor with a value of 4.7 μF to 10 μF and a voltage rating of 25 V or higher is recommended. X5R or X7R dielectrics are suitable for this application.
  • Use a shielded inductor, keep the layout compact, and use a common-mode choke to reduce EMI. Ensure that the PCB layout follows good EMI design practices, such as separating analog and digital grounds.
  • The maximum allowed voltage drop across the device is 0.5 V. Exceeding this value may affect the device's reliability and performance.

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ICE3BR0680JZ Overview

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