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ICE5GR4780AGXUMA1 - Infineon

Description: Fixed Frequency 700 V/800 V CoolSET™ - in DSO12 Package

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ICE5GR4780AGXUMA1 - Infineon PCB footprint - Other - Other - ICE5GR4780AGXUMA1-4
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ICE5GR4780AGXUMA1 - Infineon  - 3D model - Other - ICE5GR4780AGXUMA1-4
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ICE5GR4780AGXUMA1 Details

  • Manufacturer Part Number:

    ICE5GR4780AGXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Terminal Finish:

    Tin (Sn)

ICE5GR4780AGXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide and layout recommendations in their application notes and evaluation boards. It's essential to follow these guidelines to ensure proper heat dissipation, signal integrity, and electromagnetic compatibility.
  • To optimize power consumption, use the device's built-in power-saving features, such as dynamic voltage and frequency scaling, and adjust the clock frequency according to system requirements. Additionally, optimize the system's power supply design and use low-power modes when possible.
  • The ICE5GR4780AGXUMA1 requires a stable input voltage of 1.0V to 1.2V, with a recommended tolerance of ±5%. Ensure a stable voltage by using a high-quality voltage regulator, decoupling capacitors, and a well-designed power distribution network.
  • Use Infineon's debugging tools, such as the ICE5GR4780AGXUMA1 evaluation board and the company's proprietary debugging software. Additionally, implement robust error detection and correction mechanisms, and use logging and tracing features to identify and diagnose issues.
  • The ICE5GR4780AGXUMA1 has a maximum junction temperature of 125°C. Ensure proper thermal management by using a heat sink, thermal interface material, and a well-designed thermal conduction path. Monitor the device's temperature and adjust the system's thermal design accordingly.

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