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ICL7650SCPD - Renesas Electronics

Description: Operational Amplifier

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ICL7650SCPD - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - E14.3 (JEDEC MS-001-AA ISSUE D) 14 LEAD DUAL-IN-LINE PLASTIC PACKAGE
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3D Models
ICL7650SCPD - Renesas Electronics  - 3D model - Dual-In-Line Packages - E14.3 (JEDEC MS-001-AA ISSUE D) 14 LEAD DUAL-IN-LINE PLASTIC PACKAGE
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ICL7650SCPD Details

  • Manufacturer Part Number:

    ICL7650SCPD

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DIP-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    120 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8 µV

  • JESD-30 Code:

    R-PDIP-T14

  • Length:

    19.17 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -16 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    5.33 mm

  • Slew Rate-Nom:

    2.5 V/us

  • Supply Current-Max:

    3.2 mA

  • Supply Voltage Limit-Max:

    9 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    3162277.66

  • Wideband:

    NO

  • Width:

    7.62 mm

ICL7650SCPD Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the ICL7650SCPD involves keeping the input and output pins as far apart as possible, using a ground plane to reduce noise, and placing decoupling capacitors close to the power pins. Additionally, it's recommended to use a separate analog ground plane and to keep the analog and digital grounds separate.
  • To ensure the ICL7650SCPD is operating within its recommended operating conditions, it's essential to check the voltage supply, operating temperature, and input/output voltage ranges. The device should be operated within the recommended voltage range of 4.5V to 36V, and the operating temperature should be between -40°C to 85°C. Additionally, the input and output voltage ranges should be within the specified limits.
  • When selecting the correct output capacitor value for the ICL7650SCPD, key considerations include the output voltage ripple, output current, and stability. A larger output capacitor value can reduce output voltage ripple but may affect stability. A general rule of thumb is to use a capacitor value between 1uF to 10uF, but the optimal value depends on the specific application requirements.
  • To troubleshoot common issues such as oscillation or instability with the ICL7650SCPD, start by checking the power supply voltage, output capacitor value, and PCB layout. Ensure that the device is operated within its recommended operating conditions, and check for any signs of overheating. Use an oscilloscope to measure the output voltage and current, and check for any signs of oscillation or instability. If the issue persists, consult the datasheet and application notes for further guidance.
  • The ICL7650SCPD is rated for operation up to 85°C, but high-temperature operation can affect its performance and reliability. To ensure reliable operation in high-temperature environments, it's essential to consider the device's thermal characteristics, such as the junction-to-ambient thermal resistance. Use a heat sink or thermal interface material to reduce the junction temperature, and ensure good airflow around the device. Additionally, consider using a device with a higher temperature rating or implementing thermal monitoring and shutdown mechanisms.

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