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ICL8002GXUMA1 - Infineon

Description: Infineon ICL8002GXUMA1 LED Driver IC, -0.3 → 27 V 10mA 8-Pin

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ICL8002GXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - DSO-8
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ICL8002GXUMA1 - Infineon  - 3D model - Small Outline Packages - DSO-8
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ICL8002GXUMA1 Details

  • Manufacturer Part Number:

    ICL8002GXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    130 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2.3 mA

  • Supply Voltage-Max:

    19 V

  • Supply Voltage-Min:

    17 V

  • Supply Voltage-Nom:

    18 V

  • Supply Voltage1-Max:

    1.65 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    1.65 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

ICL8002GXUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermal sensor to monitor the device temperature.
  • Handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and personnel are grounded. Avoid touching the device pins or leads.
  • Yes, but ensure that the device is properly sealed or coated to prevent moisture ingress. Follow the recommended storage and handling guidelines to prevent moisture-related issues.
  • Check the input voltage, output load, and feedback resistors. Verify that the device is properly configured and that the output capacitor is suitable for the application. Consult the datasheet and application notes for troubleshooting guidelines.

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ICL8002GXUMA1 Overview

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