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ICM7217IPI+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - ICM7217IPI+ - COUNTER, UP/DOWN, 4DIGIT, DIP-28

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ICM7217IPI+ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 21-0044
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ICM7217IPI+ - Analog Devices  - 3D model - Dual-In-Line Packages - 21-0044
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ICM7217IPI+ Details

  • Manufacturer Part Number:

    ICM7217IPI+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    28-PDIP-600_MIL

  • Package Description:

    PLASTIC, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    28-PDIP-600_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1986-04-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Data Input Mode:

    PARALLEL

  • Display Mode:

    SEGMENT

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDIP-T28

  • JESD-609 Code:

    e3

  • Length:

    36.83 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    YES

  • Number of Digits/Characters:

    4-DIGIT

  • Number of Functions:

    1

  • Number of Segments:

    7

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.445 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15.24 mm

ICM7217IPI+ Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCC first, followed by VDD. This ensures that the internal voltage regulators are properly initialized.
  • To ensure accurate voltage measurement, it is essential to use a low-impedance voltage source and to minimize noise on the voltage input pins. Additionally, the input voltage range should be within the specified limits, and the device should be operated within the recommended temperature range.
  • The NO CONNECT pins on the ICM7217IPI+ are not connected internally and should be left unconnected in the application circuit. They are provided to facilitate easier PCB layout and to reduce the risk of accidental connections.
  • Yes, the ICM7217IPI+ can be used with a single power supply. In this case, the VCC and VDD pins should be connected together and powered from the same supply voltage. However, this may affect the device's performance and accuracy.
  • To troubleshoot issues with the ICM7217IPI+, start by verifying that the power supply voltages are within the specified limits and that the device is properly connected. Check the input voltage range and ensure that it is within the specified limits. Also, verify that the device is operated within the recommended temperature range. If the issue persists, consult the datasheet and application notes for further guidance.

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ICM7217IPI+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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