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IDDD12G65C6XTMA1 - Infineon

Description: Diode Silicon Carbide Schottky 650 V 34A (DC) Surface Mount PG-HDSOP-10-1

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IDDD12G65C6XTMA1 - Infineon - PCB symbol
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PCB Footprints
IDDD12G65C6XTMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-HDSOP-10-1
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3D Models
IDDD12G65C6XTMA1 - Infineon - 3D model - Small Outline Packages - PG-HDSOP-10-1
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IDDD12G65C6XTMA1 Details

  • Manufacturer Part Number:

    IDDD12G65C6XTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HDSOP-10-1, 10PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.35 V

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    51 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    34 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    120 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    420 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

IDDD12G65C6XTMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IDDD12G65C6XTMA1 is -40°C to 150°C.
  • To ensure reliability, follow the recommended thermal design and layout guidelines, and consider using thermal interface materials to reduce thermal resistance. Additionally, ensure proper cooling and heat dissipation mechanisms are in place.
  • Follow the recommended PCB layout guidelines provided in the datasheet, including keeping the power and ground planes as close as possible to the device, using a solid ground plane, and minimizing trace lengths and widths.
  • Use a suitable heat sink and thermal interface material, and ensure proper cooling and heat dissipation mechanisms are in place. Additionally, consider using a current sense resistor and a suitable power supply to handle the high current requirements.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures to prevent damage. The device has built-in ESD protection, but it's still important to follow proper handling and storage procedures.

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IDDD12G65C6XTMA1 Overview

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