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IDH04G65C6XKSA1 - Infineon

Description: Schottky Diodes & Rectifiers SIC DIODES

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IDH04G65C6XKSA1 - Infineon - PCB symbol
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PCB Footprints
IDH04G65C6XKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO220-2
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3D Models
IDH04G65C6XKSA1 - Infineon - 3D model - Transistor Outline, Vertical - PG-TO220-2
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IDH04G65C6XKSA1 Details

  • Manufacturer Part Number:

    IDH04G65C6XKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-220, 2 PIN

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.35 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    23 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    12 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    45 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    14 µA

  • Reverse Test Voltage:

    420 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

IDH04G65C6XKSA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IDH04G65C6XKSA1 is -40°C to 150°C.
  • To ensure reliability, it is recommended to follow the recommended operating conditions, use a suitable thermal management system, and implement proper thermal design and layout considerations.
  • The recommended PCB layout and thermal design for the IDH04G65C6XKSA1 can be found in the Infineon application note AN2019-01, which provides guidelines for thermal design and layout considerations.
  • To handle the high current and power dissipation requirements of the IDH04G65C6XKSA1, it is recommended to use a suitable heat sink, ensure good thermal conductivity, and implement proper power supply and current sensing designs.
  • The IDH04G65C6XKSA1 has built-in ESD protection and latch-up prevention measures, but it is still recommended to follow proper handling and assembly procedures to prevent damage.

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IDH04G65C6XKSA1 Overview

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