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IDK20G120C5XTMA1 - Infineon

Description: Silicon Carbide Schottky Diode, CoolSiC 5G Series, Single, 1.2 kV, 56 A, 82 nC, TO-263 (D2PAK)

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IDK20G120C5XTMA1 - Infineon PCB footprint - Other - Other - PG-TO263-2_2025-1.1
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IDK20G120C5XTMA1 - Infineon  - 3D model - Other - PG-TO263-2_2025-1.1
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IDK20G120C5XTMA1 Details

  • Manufacturer Part Number:

    IDK20G120C5XTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-263, 2 PIN

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    1200 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    198 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    56 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    330 W

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    123 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

IDK20G120C5XTMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN2014-01) that outlines the recommended PCB layout and thermal design guidelines for the IDK20G120C5XTMA1. It's essential to follow these guidelines to ensure optimal performance, thermal management, and reliability.
  • The choice of gate driver depends on the specific application requirements, such as voltage, current, and switching frequency. Infineon recommends using their dedicated gate driver ICs, such as the 1EDC or 2EDL families, which are optimized for their IGBT modules. Consult the gate driver datasheet and application notes for selection guidance.
  • Infineon provides a dedicated application note (AN2015-01) that outlines the recommended soldering and assembly procedures for their IGBT modules, including the IDK20G120C5XTMA1. It's crucial to follow these guidelines to ensure reliable connections and prevent damage to the module.
  • Implementing overvoltage and overcurrent protection is critical to ensure the reliability and lifespan of the IGBT module. Infineon recommends using external protection circuits, such as voltage clamps and current sensors, in conjunction with the module's built-in protection features. Consult the datasheet and application notes for guidance on protection circuit design.
  • Effective thermal management is crucial in high-power applications to prevent overheating and ensure reliable operation. Infineon recommends using heat sinks, thermal interfaces, and cooling systems specifically designed for high-power IGBT modules. Consult the datasheet and application notes for thermal management guidelines and recommendations.

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