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IDT7006L20JGI - Renesas Electronics

Description: IDT SRAM Memory, IDT7006L20JGI- 128kbit

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IDT7006L20JGI - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - PLG68-ren2
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3D Models
IDT7006L20JGI - Renesas Electronics  - 3D model - Plastic Leaded Chip Carrier - PLG68-ren2
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IDT7006L20JGI Details

  • Manufacturer Part Number:

    IDT7006L20JGI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, PLCC-68

  • Country Of Origin:

    Philippines, Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    20 ns

  • JESD-30 Code:

    S-PQCC-J68

  • JESD-609 Code:

    e3

  • Length:

    24.2062 mm

  • Memory Density:

    131072 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    68

  • Number of Words:

    16384 words

  • Number of Words Code:

    16000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.572 mm

  • Supply Current-Max:

    0.32 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Width:

    24.2062 mm

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IDT7006L20JGI Overview

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