IFSC1008ABER4R7M01 footprint, schematic symbol and 3D model by Vishay

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IFSC1008ABER4R7M01 Details

The recommended PCB footprint for the IFSC1008ABER4R7M01 is a rectangular pad with a size of 1.1 mm x 0.8 mm, with a 0.3 mm radius corner and a 0.2 mm spacing between pads.
The IFSC1008ABER4R7M01 has a thermal resistance of 35°C/W. To handle thermal management, ensure good airflow, use a heat sink if necessary, and avoid overheating the device.
The maximum operating temperature range for the IFSC1008ABER4R7M01 is -40°C to 125°C.
To ensure reliability, follow proper handling and storage procedures, use a clean and dry environment, and avoid mechanical stress, electrical overstress, and thermal shock.
The recommended soldering profile for the IFSC1008ABER4R7M01 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C.

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