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IFSC1515AHER330M01 - Vishay

Description: VISHAY - IFSC1515AHER330M01 - Power Inductor (SMD), 33 µH, 900 mA, Shielded, 680 mA, IFSC-1515AH-01 Series, 3.8mm x 3.8mm x 1.8mm

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IFSC1515AHER330M01 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - IFSC1515AHER3R3M01
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IFSC1515AHER330M01 - Vishay  - 3D model - Inductors Precision Moulded - IFSC1515AHER3R3M01
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IFSC1515AHER330M01 Details

  • Manufacturer Part Number:

    IFSC1515AHER330M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.6

  • Case/Size Code:

    1515

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.486 Ω

  • Inductance-Nom (L):

    33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.8 mm

  • Package Length:

    4 mm

  • Package Style:

    SMT

  • Package Width:

    4 mm

  • Packing Method:

    TR

  • Rated Current-Max:

    0.9 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IFSC1515AHER330M01 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • Monitor the device's voltage, current, and temperature to ensure they are within the specified limits. Use a thermal management system to prevent overheating.
  • A soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds is recommended. Avoid exceeding 280°C (536°F) to prevent damage.
  • Yes, but additional testing and qualification may be required. Consult with Vishay Intertechnologies for specific requirements and documentation.
  • Handle the device in an ESD-controlled environment, use ESD-protective packaging, and follow proper grounding procedures to prevent damage.

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IFSC1515AHER330M01 Overview

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