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IFX20001MBV33HTSA1 - Infineon

Description: Infineon IFX20001MBV33HTSA1, LDO Voltage Regulator, 30mA, 3.3 V, 4%, 4 → 45 Vin 5-Pin, SCT595

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IFX20001MBV33HTSA1 - Infineon PCB footprint - Other - Other - PG-SCT595-5_1
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IFX20001MBV33HTSA1 Details

  • Manufacturer Part Number:

    IFX20001MBV33HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SCT-595, 5 PIN

  • Pin Count:

    5

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.3 V

  • Dropout Voltage1-Nom:

    0.25 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    4 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.02%

  • Load Regulation-Max:

    0.02%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.03 A

  • Output Voltage1-Max:

    3.43 V

  • Output Voltage1-Min:

    3.17 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    SCT-595

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3.93%

  • Width:

    1.6 mm

IFX20001MBV33HTSA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple or thermistor to monitor the device temperature.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering or hand soldering, as it may damage the device.
  • Yes, but ensure that the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Also, consider using a vibration-dampening material or a shock-absorbing mount.
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the device is properly configured and that the output voltage is within the specified range. Use an oscilloscope to measure the output voltage and check for any noise or oscillations.

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IFX20001MBV33HTSA1 Overview

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