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IFX54441EJV33XUMA1 - Infineon

Description: INFINEON - IFX54441EJV33XUMA1 - LDO, FIXED, 3.3V, 0.3A, HSOIC-8

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IFX54441EJV33XUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8
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IFX54441EJV33XUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-8
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IFX54441EJV33XUMA1 Details

  • Manufacturer Part Number:

    IFX54441EJV33XUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.4 V

  • Dropout Voltage1-Nom:

    0.27 V

  • Input Voltage Absolute-Max:

    20 V

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.02%

  • Load Regulation-Max:

    0.028%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    3.38 V

  • Output Voltage1-Min:

    3.22 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2.42%

  • Width:

    3.9 mm

IFX54441EJV33XUMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency sources, and ensure proper grounding and decoupling of the device and surrounding components.
  • The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause permanent damage to the device.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. Ensure that the device is not exposed to temperatures above 280°C.

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IFX54441EJV33XUMA1 Overview

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