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IFX54441LDV33XUMA1 - Infineon

Description: Linear Voltage Regulators INDUSTRIAL STANDARD PROD

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IFX54441LDV33XUMA1 - Infineon PCB footprint - Small Outline No-lead - Small Outline No-lead - PG-TSON-10
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IFX54441LDV33XUMA1 - Infineon  - 3D model - Small Outline No-lead - PG-TSON-10
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IFX54441LDV33XUMA1 Details

  • Manufacturer Part Number:

    IFX54441LDV33XUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSON-10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.4 V

  • Dropout Voltage1-Nom:

    0.27 V

  • Input Voltage Absolute-Max:

    20 V

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3.3 mm

  • Line Regulation-Max:

    0.02%

  • Load Regulation-Max:

    0.028%

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    10

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    20 V

  • Output Voltage1-Min:

    1.22 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSON

  • Package Equivalence Code:

    SOLCC10,.13,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.15 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2.5%

  • Width:

    3.3 mm

IFX54441LDV33XUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider using a thermal shield or heat sink with a high thermal conductivity material.
  • The power-up sequence should follow the recommended timing diagram in the datasheet. The VCC pin should be powered up first, followed by the VDD pin, and then the input signals. The power-up sequence should be completed within 10ms.
  • Check the input voltage, output voltage, and current consumption. Verify that the device is properly configured and that the output capacitor values meet the recommended specifications. Use an oscilloscope to monitor the output voltage and current waveforms.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. The input capacitor should be 10uF to 22uF, and the output capacitor should be 10uF to 47uF, depending on the output voltage and current requirements.

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IFX54441LDV33XUMA1 Overview

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