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IFX80471SKV50 - Infineon

Description: IFX80471 - Switching Regulators (Industrial)

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IFX80471SKV50 Details

  • Manufacturer Part Number:

    IFX80471SKV50

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOP-14

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    ALSO HAS CONTROL TECHNIQUE OF PFM

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    5 V

  • Input Voltage-Nom:

    13.5 V

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    8.55 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.00022 A

  • Output Voltage-Max:

    15 V

  • Output Voltage-Min:

    7 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    420 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4 mm

IFX80471SKV50 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2014-01, which includes guidelines for thermal vias, copper thickness, and component placement to minimize thermal resistance and ensure reliable operation.
  • Infineon recommends following the guidelines in the application note AN2013-01 for EMC design considerations, including proper PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure compliance with relevant standards.
  • Infineon recommends following the soldering profile guidelines in the application note AN2015-01, which includes temperature and time recommendations for reflow soldering to ensure reliable assembly and minimize the risk of damage.
  • Infineon provides a troubleshooting guide in the application note AN2016-01, which includes steps for identifying and resolving common issues, such as power supply problems, incorrect configuration, or faulty components.
  • Yes, Infineon recommends following the guidelines in the application note AN2012-01 for handling and storage, including proper packaging, humidity control, and electrostatic discharge (ESD) protection to prevent damage and ensure reliability.

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IFX80471SKV50 Overview

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