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IFX90121ELV50XUMA1 - Infineon

Description: PMIC; DC/DC converter; Uoper:4.75÷45V; Uout:5V; PG-SSOP-14-EP

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IFX90121ELV50XUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-SSOP-14-1,-2,-3-PO v02
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IFX90121ELV50XUMA1 - Infineon  - 3D model - Small Outline Packages - PG-SSOP-14-1,-2,-3-PO v02
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IFX90121ELV50XUMA1 Details

  • Manufacturer Part Number:

    IFX90121ELV50XUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    PFM CONTRO TECHNIQUE ALSO POSSIBLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    7 V

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    5.1 V

  • Output Voltage-Min:

    4.9 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Equivalence Code:

    SSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Technology:

    PMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

IFX90121ELV50XUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range.
  • Yes, but ensure the device is properly secured to the PCB using a suitable mounting method, and consider using a vibration-dampening material to minimize the impact of vibrations on the device.
  • Check the input voltage, output load, and feedback resistors. Verify that the device is properly configured and that the output voltage is within the recommended range. Consult the datasheet and application notes for troubleshooting guidelines.

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IFX90121ELV50XUMA1 Overview

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Part Image IFX90121ELV50XUMA2 Infineon Technologies AG

Switching Regulator, Current-mode, 0.5A, 2475kHz Switching Freq-Max, PDSO14