The recommended PCB footprint for the IH10EB101K is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a thermal pad of 2.5 mm x 2.5 mm.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Avoid applying excessive force or pressure during soldering.
The maximum operating temperature range for the IH10EB101K is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
Handle the IH10EB101K by the body, avoiding touching the leads or electrical contacts. Use an anti-static wrist strap or mat to prevent electrostatic discharge damage.
The recommended reflow soldering profile for the IH10EB101K is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C.
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IH10EB101K Overview
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