IHDM1008BCEV1R2M30 footprint, schematic symbol and 3D model by Vishay

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IHDM1008BCEV1R2M30 Details

The thermal resistance (Rth) of the IHDM1008BCEV1R2M30 is 2.5°C/W (junction-to-case) and 10°C/W (junction-to-ambient) when mounted on a 1 inch² (6.45 cm²) copper pad.
Yes, the IHDM1008BCEV1R2M30 is suitable for high-frequency applications up to 1 MHz due to its low ESL (Equivalent Series Inductance) of 1.5 nH and low ESR (Equivalent Series Resistance) of 1.2 mΩ.
Yes, the IHDM1008BCEV1R2M30 is compatible with lead-free soldering and meets the requirements of the RoHS (Restriction of Hazardous Substances) directive.
The recommended land pattern for the IHDM1008BCEV1R2M30 is a rectangular pad with a size of 1.27 mm x 2.54 mm (0.05 in x 0.1 in) and a thermal pad size of 3.81 mm x 3.81 mm (0.15 in x 0.15 in).
Yes, the IHDM1008BCEV1R2M30 is AEC-Q200 qualified, which means it meets the requirements for automotive applications, including high reliability and robustness.

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