IHDM1107BBEV1R1M20 - Vishay

IHDM1107BBEV1R1M20 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Vishay recommends a PCB layout with a large copper area connected to the thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch² (6.45 cm²) in size.
• How do I ensure reliable soldering of the IHDM1107BBEV1R1M20?
  To ensure reliable soldering, Vishay recommends using a soldering iron with a temperature range of 250°C to 260°C, and a soldering time of 3-5 seconds. The component should be soldered to a PCB with a solder mask and a copper thickness of at least 1 oz.
• What is the maximum allowed voltage derating for the IHDM1107BBEV1R1M20?
  Vishay recommends derating the maximum voltage by 10% to ensure reliable operation. For example, if the maximum voltage rating is 100 V, the derated voltage would be 90 V.
• How do I handle the IHDM1107BBEV1R1M20 during storage and shipping?
  Vishay recommends storing the IHDM1107BBEV1R1M20 in its original packaging or in a similar ESD-protective package. The component should be stored in a dry, cool place, away from direct sunlight and moisture. During shipping, the component should be protected from mechanical stress and vibration.
• What is the recommended reflow soldering profile for the IHDM1107BBEV1R1M20?
  Vishay recommends a reflow soldering profile with a peak temperature of 260°C ± 5°C, and a dwell time above 220°C of 30-60 seconds. The ramp-up rate should be 3°C/s, and the ramp-down rate should be 6°C/s.