IHDM1107BBEV2R0M20 - Vishay

IHDM1107BBEV2R0M20 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Vishay recommends a PCB layout with a solid copper plane underneath the device, with multiple vias to the inner layers to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
• How do I ensure reliable soldering of the IHDM1107BBEV2R0M20?
  Vishay recommends using a soldering profile with a peak temperature of 260°C (500°F) for 10-15 seconds, and a soldering iron with a temperature range of 220-240°C (428-464°F).
• What is the maximum allowed voltage derating for this device?
  The maximum allowed voltage derating for the IHDM1107BBEV2R0M20 is 80% of the rated voltage, as specified in the datasheet.
• Can I use this device in a high-frequency application?
  While the IHDM1107BBEV2R0M20 is suitable for high-frequency applications, its performance may degrade above 100 kHz. It's recommended to consult with Vishay's application engineers for specific guidance.
• How do I handle the device's thermal shutdown feature?
  The IHDM1107BBEV2R0M20 has a built-in thermal shutdown feature that activates when the junction temperature exceeds 150°C (302°F). To handle this, ensure proper heat sinking, and design your system to detect and respond to the thermal shutdown event.