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IHLP1616BZER1R0M0H - Vishay

Description: VISHAY - IHLP1616BZER1R0M0H - INDUCTOR, SHLD, 1UH, 20%, 6.1A

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IHLP1616BZER1R0M0H - Vishay - PCB symbol
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PCB Footprints
IHLP1616BZER1R0M0H - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - 4.06mm x 2mm
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IHLP1616BZER1R0M0H - Vishay - 3D model - Inductors Precision Moulded - 4.06mm x 2mm
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IHLP1616BZER1R0M0H Details

  • Manufacturer Part Number:

    IHLP1616BZER1R0M0H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Case/Size Code:

    1616

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.0285 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2 mm

  • Package Length:

    4.06 mm

  • Package Style:

    SMT

  • Package Width:

    4.06 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    6.1 A

  • Self Resonance Frequency:

    91 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP1616BZER1R0M0H Frequently Asked Questions (FAQs)

  • The recommended land pattern for IHLP1616BZER1R0M0H is a rectangular pad with a size of 1.6 mm x 1.6 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1 mm.
  • During reflow soldering, it is recommended to use a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. The component should be placed on a flat, even surface to prevent warping or damage.
  • The maximum current rating for IHLP1616BZER1R0M0H is 1.4 A, based on a temperature rise of 40°C (72°F) above the ambient temperature.
  • Yes, IHLP1616BZER1R0M0H is compatible with lead-free soldering. The component is RoHS-compliant and can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • The equivalent series resistance (ESR) of IHLP1616BZER1R0M0H is 1.0 mΩ, as specified in the datasheet.

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IHLP1616BZER1R0M0H Overview

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