The recommended land pattern for the IHLP1616BZER1R0M11 is a rectangular pad with a size of 1.6 mm x 1.6 mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP1616BZER1R0M11 has a maximum operating temperature of 125°C. Ensure good airflow around the inductor, and consider using a heat sink or thermal interface material if high currents or high ambient temperatures are expected.
The self-resonant frequency of the IHLP1616BZER1R0M11 is not explicitly stated in the datasheet, but it can be estimated to be around 100-200 MHz based on the inductor's physical characteristics and similar products.
The IHLP1616BZER1R0M11 is a surface-mount device and can be susceptible to vibration-induced failure. Ensure that the PCB is properly secured and consider using a vibration-dampening material or potting the inductor if high vibrations are expected.
Follow standard surface-mount soldering practices, ensuring the inductor is properly aligned and the soldering iron is set to the recommended temperature (around 260°C). Use a solder with a melting point above 217°C to ensure reliable joints.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
IHLP1616BZER1R0M11 Overview
Use the download button to access the IHLP1616BZER1R0M11 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IHLP1,
or try a keyword search, such as Fixed Inductors
